Preview Questions Test Engineer | Role Specific Skill

Question 1: When planning for software testing in embedded systems, what type of testing should be prioritized in the early stages?

Which action should you take?

Choose only one option

Code coverage analysis

Functional testing of core algorithms

Performance testing under load conditions

Boundary testing to validate input/output

Question 2: In an automatic test system for an embedded device, what type of signal is commonly used for synchronization purposes?

Which action should you take?

Choose only one option

A clock signal

A pulse-width modulation (PWM) signal

A constant voltage signal

A reset signal

Question 3: What is the most appropriate way to report the accuracy of a measurement system used during testing?

Which action should you take?

Choose only one option

Simply state that the measurements are accurate without justification

Report only the worst-case measurement error

Provide a subjective analysis based on visual inspection of the system

Compare the results to known reference standards and quantify the error margin

Question 4: When testing the performance of a high-frequency transformer, which parameter is most critical to measure?

Which action should you take?

Choose only one option

The core loss and efficiency at different frequencies

The output voltage regulation under varying loads

The primary and secondary winding resistance

The thermal dissipation under load

Question 5: How would you ensure consistency in reporting across multiple test sessions for a long-duration test?

Which action should you take?

Choose only one option

By using a single data point per test session

By averaging all results from individual test sessions

By implementing standardized templates for test reports

By adjusting data to fit a specific expected outcome

Question 6: When documenting test results for a PCB under stress testing, what detail should be most prominently included?

Which action should you take?

Choose only one option

A comparison between the test and previous tests with different PCB designs

Only the failure rate across multiple units

Test conditions, including temperature and applied stress, along with failure modes

A graph of current and voltage during stress application