Preview Questions PCB Assembly Technician | Role Specific Skill

Question 1: What is the most likely consequence of insufficient flux application during the soldering process?

Which action should you take?

Choose only one option

Reduced mechanical strength of the solder joint

Excessive heating of components

Poor adhesion of solder to the PCB

Excessive oxidation of solder paste

Question 2: What is the acceptable angle for bending leads of through-hole resistors?

Which action should you take?

Choose only one option

45?

30?

90?

60?

Question 3: When inserting components manually, which mistake can cause the most significant long-term reliability issue in the PCB?

Which action should you take?

Choose only one option

Applying too much solder paste on the pads

Using the wrong type of solder

Insufficient lead length for soldering

Incorrect lead insertion depth

Question 4: During thermal testing of a PCB, what is the primary concern when analyzing the circuit's performance under heat stress?

Which action should you take?

Choose only one option

Thermal expansion causing component misalignment

The change in PCB material's dielectric properties

Increased resistance in solder joints

Increased conductivity in conductive traces

Question 5: What determines the minimum drill size in PCB fabrication?

Which action should you take?

Choose only one option

Aspect ratio

Copper weight

Drill bit material

Plating thickness

Question 6: What is the typical resolution of a modern AOI machine?

Which action should you take?

Choose only one option

20 ?m

10 ?m

5 ?m

1 ?m