Preview Questions PCB Assembly Technician | Role Specific Skill

Question 1: How is solder paste thickness controlled during stencil printing?

Which action should you take?

Choose only one option

By stencil aperture size

By solder volume

By soldering temperature

By squeegee pressure

Question 2: During PCB assembly, which process step is most likely to introduce component misalignment?

Which action should you take?

Choose only one option

Component placement using pick-and-place machines

Applying the solder paste before placement

Inspection of solder joints

Cleaning the PCB after soldering

Question 3: What tool is commonly used to inspect insertion accuracy for high-density PCBs?

Which action should you take?

Choose only one option

X-ray inspection

Automated Optical Inspection (AOI)

Multimeter

Optical microscope

Question 4: In PCB fabrication, what is the typical function of a blind via?

Which action should you take?

Choose only one option

To reinforce the mechanical integrity of the PCB

To connect only the inner layers of a multi-layer PCB

To connect surface mount components to the board

To connect the outer layers to the inner layers

Question 5: How should components with thermal pads be soldered effectively?

Which action should you take?

Choose only one option

Use pre-applied solder paste

Apply solder directly

Increase soldering temperature

Perform reflow soldering

Question 6: What is the primary function of flux in soldering?

Which action should you take?

Choose only one option

Removing oxides

Increasing thermal conductivity

Enhancing mechanical strength

Lowering melting point