Question 1: What is the most likely consequence of insufficient flux application during the soldering process?
Which action should you take?
Question 2: What is the acceptable angle for bending leads of through-hole resistors?
Which action should you take?
Question 3: When inserting components manually, which mistake can cause the most significant long-term reliability issue in the PCB?
Which action should you take?
Question 4: During thermal testing of a PCB, what is the primary concern when analyzing the circuit's performance under heat stress?
Which action should you take?
Question 5: What determines the minimum drill size in PCB fabrication?
Which action should you take?
Question 6: What is the typical resolution of a modern AOI machine?
Which action should you take?