Preview Questions Electronics Testing Technician | Role Specific Skill

Question 1: When using a vector network analyzer (VNA) to measure S-parameters, what calibration method is most suitable for high-frequency PCB traces?

Which action should you take?

Choose only one option

Open-Short-Load calibration.

SOLT (Short-Open-Load-Thru) calibration.

Auto-calibration without references.

TRL (Thru-Reflect-Line) calibration.

Question 2: In high-speed digital PCB testing, which technique best mitigates the impact of electromagnetic interference (EMI) on test measurements?

Which action should you take?

Choose only one option

Use unshielded test cables

Implement differential signaling and proper PCB layout techniques like controlled impedance and ground planes

Ignore EMI and proceed with testing

Reduce the testing speed to minimize EMI

Question 3: When performing in-circuit testing (ICT) on a densely populated PCB, which technique best minimizes probe contact damage while ensuring high test coverage?

Which action should you take?

Choose only one option

Use single-point probes with high force

Implement a flying probe system with adjustable pressure and automated contact sequence

Manually probe each test point to control contact pressure

Utilize fixed probe heads regardless of PCB density

Question 4: Which information is critical to include in a test report for electronic components?

Which action should you take?

Choose only one option

Assembly guidelines

Supplier details and warranty

Product marketing strategies

Test conditions, results, and deviations

Question 5: Which test is used to identify the polarity of an electrolytic capacitor?

Which action should you take?

Choose only one option

Continuity test

ESR test

Visual inspection for markings

Voltage drop test

Question 6: When testing a PCB for power supply stability, what do you monitor?

Which action should you take?

Choose only one option

The voltage ripple and current consumption under various load conditions

The physical temperature of the components during operation

The time delay between power-on and signal output

The resistance of the components in isolation