Preview Questions Electronics Assembler | Role Specific Skill

Question 1: How can Overall Equipment Effectiveness (OEE) be improved in an assembly line?

Which action should you take?

Choose only one option

Reduce changeover time

Reduce cycle time

Increase planned downtime

Increase inventory

Question 2: How can you minimize the risk of bridging during component placement?

Which action should you take?

Choose only one option

Reduce stencil thickness

Ensure proper solder paste deposition

Use larger pad sizes

Increase solder paste volume

Question 3: In an assembly line, what is the main goal of cross-training workers in different production roles?

Which action should you take?

Choose only one option

To reduce the risk of injury on specific tasks

To enable workers to take on leadership roles

To limit training time and reduce costs

To increase overall productivity by making workers more flexible

Question 4: What is the recommended maximum temperature for lead-free soldering?

Which action should you take?

Choose only one option

270?C

350?C

320?C

400?C

Question 5: What is the acceptable leakage current limit for safety compliance testing in Class II electrical devices?

Which action should you take?

Choose only one option

1.0 mA

2.0 mA

0.25 mA

0.5 mA

Question 6: What is the potential impact of improper placement of a BGA (Ball Grid Array) component on the PCB?

Which action should you take?

Choose only one option

Reduced manufacturing costs

Faster assembly time

Improved signal integrity due to reduced lead inductance

Poor electrical performance and potential failure